Invention Grant
- Patent Title: Electronic package including electronic structure and electronic body and manufacturing method thereof
-
Application No.: US18413887Application Date: 2024-01-16
-
Publication No.: US12283560B2Publication Date: 2025-04-22
- Inventor: Feng Kao , Lung-Yuan Wang
- Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Studebaker Brackett PLLC
- Priority: TW109130061 20200902
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L21/56 ; H01L23/00
Abstract:
An electronic package is provided, which stacks an electronic structure as an integrated voltage regulator on an electronic component to facilitate close-range cooperation with the electronic component for electrical transmission.
Public/Granted literature
- US20240162180A1 ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC COMPONENT Public/Granted day:2024-05-16
Information query
IPC分类:
