Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US18348531Application Date: 2023-07-07
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Publication No.: US12283596B2Publication Date: 2025-04-22
- Inventor: Kuo-Pi Tseng , De-Fang Chen , Chao-Cheng Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/3065 ; H01L21/8234 ; H01L29/66 ; H01L29/78

Abstract:
A device includes a substrate, a channel layer, a gate structure, a first source/drain epitaxial structure, a second source/drain epitaxial structure, and a bottom dielectric structure. The channel layer is over the substrate. The gate structure is across the channel layer. The first source/drain epitaxial structure and the second source/drain epitaxial structure are on opposite sides of the channel layer and are connected to the channel layer. The bottom dielectric structure is between the first source/drain epitaxial structure and the substrate. A maximum width of the first source/drain epitaxial structure is greater than or equal to a maximum width of the bottom dielectric structure in a cross-sectional view.
Public/Granted literature
- US20230361122A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2023-11-09
Information query
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