Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17824910Application Date: 2022-05-26
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Publication No.: US12283611B2Publication Date: 2025-04-22
- Inventor: Po Jung Lin , Tzu-Yao Lin
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW110129313 20210809
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L21/02

Abstract:
A semiconductor structure includes a substrate, a first nitride layer, a second nitride layer, a third nitride layer, and a polarity inversion layer. The first nitride layer is formed on the substrate, and the polarity inversion layer formed at a surface of the first nitride layer converts a non-metallic polar surface of the first nitride layer into a metallic polar surface of the polarity inversion layer. The second nitride layer is formed on the polarity inversion layer. The third nitride layer is formed on the second nitride layer.
Public/Granted literature
- US20230045328A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2023-02-09
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