Press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a circuit board or carrier board, including a lower tool, which for pressing-is in contact against the underside of the substrate, an upper tool, which with an upper pressing unit for pressing-in the component can be moved against the component along the z-axis toward the substrate, and a changing unit for automatically changing the lower or upper tool. The changing unit includes a magazine in which a plurality of tools can be deposited, one or more tool-holders, a tool being provided in or on each of the tool-holders, a displacement unit with which the respective tool holder can be moved along a displacement direction out of the magazine and into a pressing receptacle of a pressing unit, and a locking device, with which the respective tool-holder can be locked in the pressing receptacle.