Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method thereof, and camera with alternatively arranged pixel combinations
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Application No.: US18400105Application Date: 2023-12-29
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Publication No.: US12284840B2Publication Date: 2025-04-22
- Inventor: Hiroaki Ishiwata , Sanghoon Ha
- Applicant: Sony Semiconductor Solutions Corporation
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: JP2009-173127 20090724
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/13 ; H04N25/75 ; H04N25/76 ; H04N25/77 ; H04N25/78 ; H10F39/00 ; H10F39/18

Abstract:
A solid-state imaging device includes a semiconductor substrate; and a pixel unit having a plurality of pixels on the semiconductor substrate, wherein the pixel unit includes first pixel groups having two or more pixels and second pixel groups being different from the first pixel groups, wherein a portion of the pixels in the first pixel groups and a portion of the pixels in the second pixel groups share a floating diffusion element.
Public/Granted literature
Information query
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