Invention Grant
- Patent Title: Semiconductor device with doped structure
-
Application No.: US18612701Application Date: 2024-03-21
-
Publication No.: US12288809B2Publication Date: 2025-04-29
- Inventor: Miao-Syuan Fan , Pei-Wei Lee , Ching-Hua Lee , Jung-Wei Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L21/8234 ; H01L27/088 ; H01L29/10 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
The present disclosure relates to a semiconductor device includes first and second source/drain (S/D) regions doped with lead (Pb) at a first dopant concentration. The semiconductor device also includes a channel region between the first and second S/D regions, where the channel region is doped with Pb at a second dopant concentration that is lower than the first dopant concentration. The semiconductor device further includes first and second S/D contacts in contact with the first and second S/D regions, respectively. The semiconductor device also includes a gate electrode over the channel region.
Public/Granted literature
- US20240234506A1 SEMICONDUCTOR DEVICE WITH DOPED STRUCTURE Public/Granted day:2024-07-11
Information query
IPC分类: