Invention Grant
- Patent Title: Width adjustment of EUV radiation beam
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Application No.: US18226160Application Date: 2023-07-25
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Publication No.: US12292687B2Publication Date: 2025-05-06
- Inventor: Chi Yang , Tsung-Hsun Lee , Jian-Yuan Su , Ching-Juinn Huang , Po-Chung Cheng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER BRACKETT PLLC
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F7/00 ; H01L21/027

Abstract:
In a method of pattern formation information including a pattern size on a reticle is received. A width of an EUV radiation beam is adjusted in accordance with the information. The EUV radiation beam is scanned on the reticle. A photo resist layer is exposed with a reflected EUV radiation beam from the reticle. An increase of intensity per unit area of the EUV radiation beam on the reticle after the adjusting the width is greater when the width before adjustment is W1 compared to an increase of intensity per unit area of the EUV radiation beam on the reticle after the adjusting the width when the width before adjustment is W2 when W1>W2.
Public/Granted literature
- US20230367221A1 WIDTH ADJUSTMENT OF EUV RADIATION BEAM Public/Granted day:2023-11-16
Information query
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