Invention Grant
- Patent Title: Using controlled gas pressure for backside wafer support
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Application No.: US17647543Application Date: 2022-01-10
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Publication No.: US12293934B2Publication Date: 2025-05-06
- Inventor: Paul Steffas , Kenneth S. Ledford
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/458 ; C23C16/50
Abstract:
Embodiments described herein provide substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on one or more surfaces of the substrate without contacting the one or more devices and preventing changes in profile of the substrate. The substrate support assembly allows for control of the substrate. The substrate support assembly includes a gas nozzle disposed through a body of the substrate support assembly. The gas nozzle provides a gas to the substrate. The gas is operable to provide pressure to the substrate to reduce contact on the substrate and to control the profile of the substrate.
Public/Granted literature
- US20220223462A1 USING CONTROLLED GAS PRESSURE FOR BACKSIDE WAFER SUPPORT Public/Granted day:2022-07-14
Information query
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