Invention Grant
- Patent Title: Circuit systems
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Application No.: US18671764Application Date: 2024-05-22
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Publication No.: US12293978B2Publication Date: 2025-05-06
- Inventor: Stephen Andrew Steger , Emily Lauren Clopp
- Applicant: Snap Inc.
- Applicant Address: US CA Santa Monica
- Assignee: Snap Inc.
- Current Assignee: Snap Inc.
- Current Assignee Address: US CA Santa Monica
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/552 ; H05K9/00

Abstract:
Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.
Public/Granted literature
- US20240312927A1 CIRCUIT SYSTEMS Public/Granted day:2024-09-19
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