Invention Grant
- Patent Title: Antenna substrate
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Application No.: US18033570Application Date: 2021-10-22
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Publication No.: US12294166B2Publication Date: 2025-05-06
- Inventor: Keizou Sakurai
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP2020-181700 20201029,JP2021-026542 20210222
- International Application: PCT/JP2021/039072 WO 20211022
- International Announcement: WO2022/091963 WO 20220505
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/38 ; H01Q13/08

Abstract:
An antenna substrate according to the present disclosure includes a first insulation layer including a first surface, a second surface located opposite the first surface, and a first through-hole conductor extending from the first surface to the second surface, a ground conductor located at the first surface, the ground conductor including a slot, a second insulation layer including a second through-hole conductor connected to the first through-hole conductor, the second insulation layer covering the ground conductor located at the first surface, and a first antenna conductor located at a surface located on the opposite side to the other surface of the second insulation layer, the other surface covering the ground conductor.
Public/Granted literature
- US20230395978A1 ANTENNA SUBSTRATE Public/Granted day:2023-12-07
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