Invention Grant
- Patent Title: Software integrity protection method and apparatus, and software integrity verification method and apparatus
-
Application No.: US17711879Application Date: 2022-04-01
-
Publication No.: US12294657B2Publication Date: 2025-05-06
- Inventor: Bin Cao , Haiwu Chen , Yan Chen , Bo Wang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Priority: CN201911012940.1 20191023,CN201911120987.X 20191115
- Main IPC: H04L9/32
- IPC: H04L9/32 ; H04L9/00

Abstract:
Embodiments of this application disclose a software integrity protection method and apparatus. A first device obtains a first software package, where the first software package includes a first signature made by a first party for a second software package by using a first private key; and the first device performs a signing operation on the first software package by using a second private key, to obtain a third software package including a second signature, where the first private key is controlled by the first party, and the second private key is controlled by a second party. The first device sends the third software package to a second device. The second device verifies the first signature and the second signature in the third software package respectively based on a first public key and a second public key that are prestored, to obtain a verification result.
Public/Granted literature
Information query