Invention Grant
- Patent Title: Dual liquid pump liquid cooling radiator and liquid cooling heat dissipation device
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Application No.: US18220726Application Date: 2023-07-11
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Publication No.: US12295124B2Publication Date: 2025-05-06
- Inventor: Tsung-Hsien Huang
- Applicant: Tsung-Hsien Huang
- Applicant Address: TW I-Lan Hsien
- Assignee: Tsung-Hsien Huang
- Current Assignee: Tsung-Hsien Huang
- Current Assignee Address: TW I-Lan Hsien
- Agency: Law Office of Michael Chen
- Agent Ying-Ting Chen
- Priority: TW112118342 20230517
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The invention discloses a dual liquid pump liquid cooling radiator and a liquid cooling heat dissipation device. The dual liquid pump liquid cooling radiator includes two liquid boxes and a plurality of radiator pipe sets arranged side by side between the two liquid boxes. The interior of one liquid box is divided into a hot liquid chamber and a cold liquid chamber by an air heat insulation space, and a first liquid pump is installed therein. The interior of the other liquid box is divided into a hot liquid chamber and a cold liquid chamber by a liquid barrier, and a second liquid pump is installed therein.
Public/Granted literature
- US20240389275A1 DUAL LIQUID PUMP LIQUID COOLING RADIATOR AND LIQUID COOLING HEAT DISSIPATION DEVICE Public/Granted day:2024-11-21
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