Invention Grant
- Patent Title: Fabrication of gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer
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Application No.: US17030333Application Date: 2020-09-23
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Publication No.: US12295170B2Publication Date: 2025-05-06
- Inventor: Dan S. Lavric , Dax M. Crum , Omair Saadat , Oleg Golonzka , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H10D86/00
- IPC: H10D86/00 ; H10D86/01

Abstract:
Gate-all-around integrated circuit structures having additive metal gates and gate dielectrics with a dipole layer are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, the first gate stack having a P-type conductive layer over a first gate dielectric including a high-k dielectric layer on a first dipole material layer. A second gate stack is over the second vertical arrangement of horizontal nanowires, the second gate stack having an N-type conductive layer over a second gate dielectric including the high-k dielectric layer on a second dipole material layer.
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