- Patent Title: Two-dimensional (2D) metal structure and method of forming the same
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Application No.: US18447701Application Date: 2023-08-10
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Publication No.: US12300609B2Publication Date: 2025-05-13
- Inventor: Shih-Wei Peng , Jiann-Tyng Tzeng , Ken-Hsien Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Merchant & Gould P.C.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/033 ; H01L21/768 ; H01L23/522 ; H01L27/085 ; H01L27/092

Abstract:
A semiconductor structure includes: a first gate structure and a second gate structure extending in a first direction; a first base level metal interconnect (M0) pattern extending in a second direction perpendicular to the first direction; a second M0 pattern extending in the second direction; a third M0 pattern located between the first and second gate structures and extending in the first direction, two ends of the third M0 pattern connected to the first M0 pattern and the second M0 pattern, respectively; a fourth M0 pattern and a fifth M0 pattern located between the first and second M0 patterns and extending in the second direction. A distance between the fourth M0 pattern and the first M0 pattern in the first direction is equal to a minimum M0 pattern pitch, and a distance between the fourth M0 pattern and the second M0 pattern is equal to the minimum M0 pattern pitch.
Public/Granted literature
- US20240063119A1 TWO-DIMENSIONAL (2D) METAL STRUCTURE Public/Granted day:2024-02-22
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