- Patent Title: Semiconductor device and semiconductor device manufacturing method
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Application No.: US18485336Application Date: 2023-10-12
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Publication No.: US12300726B2Publication Date: 2025-05-13
- Inventor: Takashi Yoshimura , Yuichi Onozawa , Hiroshi Takishita , Misaki Meguro , Motoyoshi Kubouchi , Naoko Kodama
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2018-051655 20180319
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/22 ; H01L21/265 ; H01L21/322 ; H01L29/06 ; H01L29/12 ; H01L29/739 ; H01L29/78 ; H01L29/861

Abstract:
A semiconductor device, including a semiconductor substrate having a transistor portion and a diode portion, a drift region of a first conductivity type provided in the semiconductor substrate, a first electrode provided on one main surface side of the semiconductor substrate, and a second electrode provided on another main surface side of the semiconductor substrate, is provided. The diode portion includes a high concentration region and a crystalline defect region. The high concentration region has a higher doping concentration than the drift region and includes hydrogen. The doping concentration of the high concentration region at a peak position in a depth direction of the semiconductor substrate is equal to or less than 1.0×1015/cm3. The crystalline defect region is provided on the one main surface side of the semiconductor substrate relative to the peak position, has a higher crystalline defect density than the drift region, and includes hydrogen.
Public/Granted literature
- US20240047535A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Public/Granted day:2024-02-08
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