Invention Grant
- Patent Title: Cable mold
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Application No.: US18117635Application Date: 2023-03-06
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Publication No.: US12300982B2Publication Date: 2025-05-13
- Inventor: Seong-jun Kim , Sung-shik Kim
- Applicant: Seong-jun Kim
- Applicant Address: KR Siheung-si
- Assignee: Seong-jun Kim
- Current Assignee: Seong-jun Kim
- Current Assignee Address: KR Siheung-si
- Agency: Park & Associates IP Law Office
- Priority: KR10-2020-0115717 20200909,KR10-2020-0145542 20201103
- Main IPC: H02G3/04
- IPC: H02G3/04 ; H02G3/00

Abstract:
The present invention relates to a cable mold for organizing and protecting indoor cable such as an electric wire or communication wire, and specifically, provides a cable mold comprising: a bottom part tightly adhering to a floor and receiving cable on top of the bottom part; a cover part for covering the upper side of the bottom part, and receiving the cable under the cover part; a connection part for integrally connecting the respective one-side front ends of the bottom part and cover part, and enabling the cover part to open and close; lock parts each correspondingly formed on the respective other-side front ends of the bottom part and cover part so as to be capable of being fastened to and separated from each other; and an opening/closing means part formed on the other side of the bottom part or cover part so as to enable the cover part to be opened. Thus, the cover part may be opened/closed more smoothly and stably, and at the same time, may be easily opened by hand.
Public/Granted literature
- US20230208117A1 CABLE MOLD Public/Granted day:2023-06-29
Information query
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