Invention Grant
- Patent Title: Modular system (switch boards and mid-plane) for supporting 50G or 100G ethernet speeds of FPGA+SSD
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Application No.: US16202079Application Date: 2018-11-27
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Publication No.: US12301372B2Publication Date: 2025-05-13
- Inventor: Sompong Paul Olarig
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Renaissance IP Law Group LLP (SSI)
- Main IPC: G06F13/00
- IPC: G06F13/00 ; G06F30/331 ; H03K19/173 ; H04L12/04 ; H04L12/44 ; G06F13/38 ; G06F13/40
Abstract:
A chassis front-end is disclosed. The chassis front-end may include a switchboard including an Ethernet switch, a Baseboard Management Controller, and a mid-plane connector. The chassis front-end may also include a mid-plane including at least one storage device connector and a speed logic to inform at least one storage device of an Ethernet speed of the chassis front-end. The Ethernet speeds may vary.
Public/Granted literature
- US12335054B2 Modular system (switch boards and mid-plane) for supporting 50G or 100G ethernet speeds of FPGA+SSD Public/Granted day:2025-06-17
Information query
