Invention Grant
- Patent Title: Semiconductor memory structure
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Application No.: US17661349Application Date: 2022-04-29
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Publication No.: US12302549B2Publication Date: 2025-05-13
- Inventor: Shuai Guo
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: SYNCODA LLC
- Agent Feng Ma
- Priority: CN202111296771.6 20211102
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A semiconductor structure, a forming method thereof and a memory are provided. Wherein the semiconductor structure includes: a substrate; a bit line layer, located in the substrate; a word line stack layer, located on the substrate, wherein the word line stack layer includes a word line layer; and a gap, located between the bit line layer and the word line layer.
Public/Granted literature
- US20230138466A1 SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF AND MEMORY Public/Granted day:2023-05-04
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