Invention Grant
- Patent Title: Semiconductor device and method for manufacturing thereof
-
Application No.: US17833307Application Date: 2022-06-06
-
Publication No.: US12315740B2Publication Date: 2025-05-27
- Inventor: Kenta Watanabe , Takashi Okawa
- Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation
- Applicant Address: JP Kariya; JP Toyota; JP Nisshin
- Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee: DENSO CORPORATION,TOYOTA JIDOSHA KABUSHIKI KAISHA,MIRISE Technologies Corporation
- Current Assignee Address: JP Kariya; JP Toyota; JP Nisshin
- Agency: Posz Law Group, PLC
- Priority: JP2021-100862 20210617
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/02 ; H10D62/85

Abstract:
A semiconductor device includes: a compound semiconductor layer having a first compound semiconductor layer and a second compound semiconductor layer having a higher melting point than the first compound semiconductor layer; and an insulation gate on the second compound semiconductor layer. The compound semiconductor layer further includes: a drift region; a source region; and a body region between the drift region and the source region. The insulation gate faces the body region. The body region bridges over both the first compound semiconductor layer and the second compound semiconductor layer.
Public/Granted literature
- US20220406614A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2022-12-22
Information query
IPC分类: