Invention Grant
- Patent Title: Semiconductor device package assemblies with direct leadframe attachment
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Application No.: US18390928Application Date: 2023-12-20
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Publication No.: US12315826B2Publication Date: 2025-05-27
- Inventor: Seungwon Im , Oseob Jeon
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Scottsdale
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/48 ; H01L23/31 ; H01L23/495
Abstract:
In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a conductive adhesive.
Public/Granted literature
- US20240250042A1 SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES WITH DIRECT LEADFRAME ATTACHMENT Public/Granted day:2024-07-25
Information query
IPC分类:
