Invention Grant
- Patent Title: External laser enabled co-packaged optics architectures
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Application No.: US18663749Application Date: 2024-05-14
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Publication No.: US12316382B2Publication Date: 2025-05-27
- Inventor: Domenico Di Mola , Steven B. Alleston , Zhen Qu , Ryan Holmes , Jeffery J. Maki , Chul Soo Park , Yang Yue , Jon J. Anderson
- Applicant: Juniper Networks, Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04B10/2581
- IPC: H04B10/2581 ; G02B6/42 ; H01S5/40 ; H04B10/40 ; H04B10/50 ; H04B10/516 ; H04B10/60 ; H04J14/02 ; H04J14/04

Abstract:
A sourceless co-packaged optical-electrical chip can include a plurality of different optical transceivers, each of which can transmit to an external destination or internal components. Each of the transceivers can be configured for a different modulation format, such as different pulse amplitude, phase shift key, and quadrature amplitude modulation formats. Different light sources provide light for processing by the transceivers, where the light source and transceivers can be configured for different applications (e.g., different distances) and data rates. An optical coupler can combine the light for the different transceivers for input into the sourceless co-packaged optical-electrical chip via a polarization maintaining media (e.g., polarization maintaining few mode fiber and polarization maintaining single mode fiber), where another coupler operates in splitting mode to separate the different channels of light for the different transceivers according to different co-packaged configurations.
Public/Granted literature
- US20240305376A1 EXTERNAL LASER ENABLED CO-PACKAGED OPTICS ARCHITECTURES Public/Granted day:2024-09-12
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