Invention Grant
- Patent Title: SOT MRAM structure and fabricating method of the same
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Application No.: US17964935Application Date: 2022-10-13
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Publication No.: US12317512B2Publication Date: 2025-05-27
- Inventor: Chih-Wei Kuo , Hung-Chan Lin , Chung-Yi Chiu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN202211157193.2 20220922
- Main IPC: H10B61/00
- IPC: H10B61/00 ; H10N52/00 ; H10N52/01 ; H10N52/80

Abstract:
An SOT MRAM structure includes a word line. A second source/drain doping region and a fourth source/drain doping region are disposed at the same side of the word line. A first conductive line contacts the second source/drain doping region. A second conductive line contacts the fourth source/drain doping region. The second conductive line includes a third metal pad. A memory element contacts an end of the first conductive line. A second SOT element covers and contacts a top surface of the memory element. The third metal pad covers and contacts part of the top surface of the second SOT element.
Public/Granted literature
- US20240107777A1 SOT MRAM STRUCTURE AND FABRICATING METHOD OF THE SAME Public/Granted day:2024-03-28
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