Invention Grant
- Patent Title: Memory chip and memory system including the same
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Application No.: US18189756Application Date: 2023-03-24
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Publication No.: US12322437B2Publication Date: 2025-06-03
- Inventor: Kwangsook Noh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR10-2022-0076632 20220623
- Main IPC: G11C11/408
- IPC: G11C11/408 ; G11C11/4093 ; G11C11/4096 ; G11C11/00

Abstract:
A memory chip includes a plurality of storage blocks respectively including a plurality of memory cells; and a logic circuit configured to control the plurality of storage blocks, wherein the logic circuit includes an input/output pad configured to input data to the plurality of storage blocks and output data to the plurality of storage blocks; wherein the logic circuit is further configured to allocate block address codes having a bit inversion relationship with each other, output a mode selection signal in response to external control, output an external address code in response to the mode selection signal indicating a first addressing mode, and output an address code having a bit inversion relationship with regard to the external address code in response to the mode selection signal indicating a second addressing mode, and select a storage block to be controlled by the access command from among the plurality of storage blocks.
Public/Granted literature
- US20230420039A1 MEMORY CHIP AND MEMORY SYSTEM INCLUDING THE SAME Public/Granted day:2023-12-28
Information query
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