- Patent Title: Multilayer inductor and mounting structure of multilayer inductor
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Application No.: US17568754Application Date: 2022-01-05
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Publication No.: US12322538B2Publication Date: 2025-06-03
- Inventor: Noriaki Hamachi , Toshinori Matsuura , Junichiro Urabe , Kazuya Tobita , Yuto Shiga , Youichi Kazuta , Yuichi Takubo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2021-001494 20210107
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/06 ; H01F27/28 ; H01F41/04

Abstract:
A multilayer inductor includes: an element body formed by stacking a plurality of layers of insulators in a stacking direction; a terminal electrode provided on at least one side surface of the element body; and a linear conductor portion provided in the element body and extending in a first direction, wherein, as viewed from a second direction perpendicular to the first direction, the conductor portion has a first portion in a region overlapping the terminal electrode and a second portion in a region not overlapping the terminal electrode, and wherein a width of the first portion as viewed from the second direction is smaller than a width of the second portion.
Public/Granted literature
- US20220216003A1 MULTILAYER INDUCTOR AND MOUNTING STRUCTURE OF MULTILAYER INDUCTOR Public/Granted day:2022-07-07
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