Invention Grant
- Patent Title: Metal contamination reduction in substrate processing systems with transformer coupled plasma
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Application No.: US17363870Application Date: 2021-06-30
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Publication No.: US12322579B2Publication Date: 2025-06-03
- Inventor: Maolin Long , Neema Rastgar , Alexander Miller Paterson
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: PENILLA IP, APC
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01J37/32 ; H01L21/67 ; H01L21/683
Abstract:
A substrate processing system includes a processing chamber including a substrate support to support a substrate. A coil includes at least one terminal. An RF source configured to supply RF power to the coil. A dielectric window is arranged on one surface of the processing chamber adjacent to the coil. A contamination reducer includes a first plate that is arranged between the at least one terminal of the coil and the dielectric window.
Public/Granted literature
- US20210327689A1 METAL CONTAMINATION REDUCTION IN SUBSTRATE PROCESSING SYSTEMS WITH TRANSFORMER COUPLED PLASMA Public/Granted day:2021-10-21
Information query
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