Invention Grant
- Patent Title: Wafer processing apparatus and wafer processing method
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Application No.: US17725054Application Date: 2022-04-20
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Publication No.: US12322607B2Publication Date: 2025-06-03
- Inventor: Seung Dae Baek , Kuem Dong Heo , Kang Won Lee , Woon Kong
- Applicant: ZEUS CO., LTD.
- Applicant Address: KR Hwaseong-si
- Assignee: ZEUS CO., LTD.
- Current Assignee: ZEUS CO., LTD.
- Current Assignee Address: KR Hwaseong-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR10-2021-0051544 20210421
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687
Abstract:
A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.
Public/Granted literature
- US20220344177A1 WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD Public/Granted day:2022-10-27
Information query
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