A semiconductor manufacturing device includes a table having an upper face on which a frame having a first opening to which a substrate is fixed by an adhesive is disposed, the table having a plurality of first through holes penetrating the table in a vertical direction and provided side by side in a first direction parallel to the upper face and a plurality of second through holes each provided between the adjacent first through holes and penetrating the table in the vertical direction; and a container provided on the table, the container including a first sidewall provided on the frame, a second sidewall provided on the frame, the second sidewall facing the first sidewall, a distance between the second sidewall and the first sidewall being larger than a first inner diameter of the first opening, and a joint allowing an outside of the container and an inside of the container to communicate with each other.