Invention Grant
- Patent Title: Transfer apparatus and transfer method
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Application No.: US17446739Application Date: 2021-09-02
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Publication No.: US12322629B2Publication Date: 2025-06-03
- Inventor: Tomonori Horiuchi , Dongwei Li
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JP2020-151787 20200910
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B25J11/00 ; B25J15/00 ; B65G49/06 ; H01L21/67 ; H01L21/687

Abstract:
A transfer apparatus transfers a first substrate and a second substrate while holding the first substrate and the second substrate to overlap each other in a plan view. The transfer apparatus includes: a first holding arm configured to hold the first substrate in a horizontal direction; a second holding arm configured to hold the second substrate in the horizontal direction; a first detection sensor configured to detect presence/absence of the first substrate held by the first holding arm; and a second detection sensor configured to detect presence/absence of the second substrate held by the second holding arm, wherein the first detection sensor includes a sensor configured to detect the presence/absence of the first substrate, and wherein the first holding arm includes a notch formed at least at an inner end portion of a tip of the first holding arm and configured to allow the optical axis to pass therethrough.
Public/Granted literature
- US20220076977A1 TRANSFER APPARATUS AND TRANSFER METHOD Public/Granted day:2022-03-10
Information query
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