Invention Grant
- Patent Title: Package assembly lid and methods for forming the same
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Application No.: US17750428Application Date: 2022-05-23
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Publication No.: US12322666B2Publication Date: 2025-06-03
- Inventor: Yu-Sheng Lin , Shu-Shen Yeh , Chien-Shen Chen , Po-Yao Lin , Shin-Puu Jeng , Ming-Chih Yew , Chin-Hua Wang , Po-Chen Lai , Chia-Kuei Hsu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L21/48 ; H01L23/00 ; H01L23/055 ; H01L25/065
Abstract:
A package assembly includes a package substrate, an interposer module on the package substrate, and a package lid on the interposer module and attached to the package substrate. The package lid includes an outer lid including an outer lid material and including an outer lid plate portion. The package lid further includes an inner lid including an inner lid material different than the outer lid material and including an inner lid plate portion attached to a bottom surface of the outer lid plate portion.
Public/Granted literature
- US20230378007A1 PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME Public/Granted day:2023-11-23
Information query
IPC分类:
