Invention Grant
- Patent Title: Thermal spreader including ringframe and thermal straps for thermal dissipation in space and other applications
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Application No.: US17650599Application Date: 2022-02-10
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Publication No.: US12322674B2Publication Date: 2025-06-03
- Inventor: Keith R. Burrell , Andrew J. Bristol , Rosalio S. Vidaurri , Kevin A. Miyamoto
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H01L25/065
Abstract:
An apparatus includes a thermal spreader configured to remove thermal energy from a device to be cooled. The thermal spreader includes a ringframe having an opening, where the opening is configured to provide access to the device through the ringframe. The thermal spreader also includes a pair of thermal straps configured to fit within the opening. The pair of thermal straps is configured to be bonded to the device and to be fastened to the ringframe in order to provide the thermal energy from the device to the ringframe.
Public/Granted literature
- US20230253290A1 THERMAL SPREADER FOR THERMAL DISSIPATION IN SPACE AND OTHER APPLICATIONS Public/Granted day:2023-08-10
Information query
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