Invention Grant
- Patent Title: Micro-electro-mechanical system structure
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Application No.: US17933208Application Date: 2022-09-19
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Publication No.: US12323753B2Publication Date: 2025-06-03
- Inventor: Chih-Yuan Chen , Feng-Chia Hsu , Chun-Kai Mao , Jien-Ming Chen , Wen-Shan Lin , Nai-Hao Kuo
- Applicant: Fortemedia, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Fortemedia, Inc.
- Current Assignee: Fortemedia, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R1/08 ; H04R7/04 ; H04R19/00 ; H04R19/01
Abstract:
A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.
Public/Granted literature
- US20230319450A1 MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURE Public/Granted day:2023-10-05
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