Invention Grant
- Patent Title: Headphone cover and fastener therefor, and headphone cover mounting method
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Application No.: US18041874Application Date: 2020-08-19
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Publication No.: US12323754B2Publication Date: 2025-06-03
- Inventor: Masayuki Hayashi
- Applicant: Fifty Square Inc.
- Applicant Address: JP Tokyo
- Assignee: Fifty Square Inc.
- Current Assignee: Fifty Square Inc.
- Current Assignee Address: JP Tokyo
- Agency: POLSINELLI PC
- International Application: PCT/JP2020/031248 WO 20200819
- International Announcement: WO2022/038706 WO 20220224
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10

Abstract:
Provided is a headphone cover configured such that an ear pad is covered with a fabric from the outer peripheral surface to the inner peripheral surface thereof, and a part of the fabric is fixed to the inner peripheral surface or the like of the ear pad using a fixing member 20 such that the recessed space formed in the middle portion of the ear pad is not closed. The fixing member 20 is formed of a belt-like member 21 having flexibility, a plurality of first locking portions 22 is formed on the upper surface of the belt-like member 21 while a second locking portion 23 is formed on the lower surface of the belt-like member. The fixing member is provided with a holding portion 24 for slidably holding a portion other than the rear end of the belt-like member 21. Then, the first locking portion 22 and the second locking portion 23 are formed in a shape in which the belt-like member 21 is slidable only in one direction in which the length from the rear end of the belt-like member 21 in the longitudinal direction to a portion held by the holding portion 24 is shortened in a state in which the portion of the belt-like member 21 is held by the holding portion 24 so that the headphone cover can be used on as many sizes of headphones as possible.
Public/Granted literature
- US20230319451A1 HEADPHONE COVER AND FASTENER THEREFOR, AND HEADPHONE COVER MOUNTING METHOD Public/Granted day:2023-10-05
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