Invention Grant
- Patent Title: Manifold systems, devices, and methods for thermal management of hardware components
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Application No.: US18198522Application Date: 2023-05-17
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Publication No.: US12324131B2Publication Date: 2025-06-03
- Inventor: Raffaele Luca Amalfi , Ryan Enright , John Kim
- Applicant: Seguente, Inc.
- Applicant Address: US FL Melbourne
- Assignee: Seguente, Inc.
- Current Assignee: Seguente, Inc.
- Current Assignee Address: US FL Melbourne
- Agency: Steinberger IP Law
- Agent Brian S. Steinberger; Hilary F. Steinberger
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data centers.
Public/Granted literature
- US20230380114A1 Manifold Systems, Devices, and Methods for Thermal Management of Hardware Components Public/Granted day:2023-11-23
Information query
