Invention Grant
- Patent Title: Semiconductor device and method of forming the same
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Application No.: US18358962Application Date: 2023-07-26
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Publication No.: US12324235B2Publication Date: 2025-06-03
- Inventor: Yu-San Chien , Chun-Sheng Liang , Jhon-Jhy Liaw , Kuo-Hua Pan , Hsin-Che Chiang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Cooper Legal Group, LLC
- Main IPC: H10D84/85
- IPC: H10D84/85 ; H10D84/01 ; H10D84/03

Abstract:
Provided is a semiconductor device including a substrate, one hybrid fin, a gate, and a dielectric structure. The substrate includes at least two fins. The hybrid fin is disposed between the at least two fins. The gate covers portions of the at least two fins and the hybrid fin. The dielectric structure lands on the hybrid fin to divide the gate into two segment. The two segments are electrically isolated to each other by the dielectric structure and the hybrid fin. The hybrid fin includes a first portion, disposed between the two segments of the gate; and a second portion, disposed aside the first portion, wherein a top surface of the second portion is lower than a top surface of the first portion.
Public/Granted literature
- US20230369336A1 METHOD OF FORMING SEMICONDUCTOR DEVICE Public/Granted day:2023-11-16
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