Invention Grant
- Patent Title: Mask blank and method of manufacturing photomask
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Application No.: US17799573Application Date: 2021-02-16
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Publication No.: US12326656B2Publication Date: 2025-06-10
- Inventor: Hitoshi Maeda , Kazutake Taniguchi , Kazuaki Matsui , Naoto Yonemaru
- Applicant: HOYA CORPORATION , TEKSCEND PHOTOMASK CORP.
- Applicant Address: JP Tokyo; JP Tokyo
- Assignee: HOYA CORPORATION,TEKSCEND PHOTOMASK CORP.
- Current Assignee: HOYA CORPORATION,TEKSCEND PHOTOMASK CORP.
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Oliff PLC
- Priority: JP2020-050946 20200323
- International Application: PCT/JP2021/005627 WO 20210216
- International Announcement: WO2021/192734 WO 20210930
- Main IPC: G03F1/32
- IPC: G03F1/32 ; G03F1/50 ; G03F1/54 ; G03F1/80 ; H01L21/3065

Abstract:
A mask blank has a structure where a thin film for pattern formation and a hard mask film are stacked in this order on a transparent substrate, featured in that the thin film is formed of a material containing chromium, the hard mask film includes a stacked structure of a lower layer and an upper layer, the lower layer is formed of a material containing silicon and oxygen, the upper layer is formed of a material containing tantalum and oxygen with an oxygen content of 30 atom % or more, and the ratio of a thickness of the upper layer relative to a total thickness of the hard mask film is 0.7 or less.
Public/Granted literature
- US20230069092A1 MASK BLANK AND METHOD OF MANUFACTURING PHOTOMASK Public/Granted day:2023-03-02
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