Invention Grant
- Patent Title: Method for adjusting chip mounting position, apparatus, medium, and electronic device
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Application No.: US17668654Application Date: 2022-02-10
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Publication No.: US12327740B2Publication Date: 2025-06-10
- Inventor: Hailin Wang
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN202110522110.4 20210513
- Main IPC: H01L21/67
- IPC: H01L21/67
Abstract:
A method for adjusting a chip mounting position, an apparatus, a medium, and an electronic device are provided. The adjustment method includes: obtaining offsets of actual mounting positions of individual chips in a first group of chips; obtaining an average offset for the actual mounting positions of the individual chips in the first group of chips according to the offsets of the actual mounting positions of the individual chips in the first group of chips; and adjusting the chip mounting position according to the average offset for the actual mounting positions of the individual chips in the first group of chips.
Public/Granted literature
- US20220367219A1 METHOD FOR ADJUSTING CHIP MOUNTING POSITION, APPARATUS, MEDIUM, AND ELECTRONIC DEVICE Public/Granted day:2022-11-17
Information query
IPC分类:
