Invention Grant
- Patent Title: Connection assembly
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Application No.: US17860793Application Date: 2022-07-08
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Publication No.: US12327958B2Publication Date: 2025-06-10
- Inventor: Tobias Morlok , Jan Bayerbach , Bernhard Brunner
- Applicant: H & B Electronic Gmbh & Co. KG , Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Applicant Address: DE Deckenpfronn; DE Munich
- Assignee: H & B Electronic Gmbh & Co. KG,Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Current Assignee: H & B Electronic Gmbh & Co. KG,Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
- Current Assignee Address: DE Deckenpfronn; DE Munich
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: DE102021118460.6 20210716
- Main IPC: H01R13/00
- IPC: H01R13/00 ; H01R4/72 ; H01R13/502 ; H01R13/58 ; H01R13/6581 ; H01R13/66

Abstract:
A connection assembly for the electrical and mechanical connection between a contact electrode and an electrical conductor element has a flexible sensor/electrode section in which the contact electrode is at least partially arranged. The connection assembly has at least one electrical inner conductor of the electrical conductor element for applying and/or removing an electrical voltage and/or capacitive change at the contact electrode. An electrical contact region is provided in which the at least one electrical inner conductor makes electrical contact with the contact electrode of the sensor. A connecting device is provided which can be prestressed against the contact electrode of the sensor in the contact region, with interposition of the inner conductor.
Public/Granted literature
- US20230021030A1 CONNECTION ASSEMBLY Public/Granted day:2023-01-19
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