A semiconductor package for a multi-phase motor driving circuit comprises a driving unit, a switching unit, a first bonding wire, and a second bonding wire. The driving unit comprises a first driving IC, a second driving IC and a third driving IC, configured to couple with a controller. The switching unit comprises a first pair of power switches, a second pair of power switches and a third pair of power switches, configured to couple with the first driving IC, the second driving IC and the third driving IC, respectively. The first bonding wire is coupled between a sensing pin of the first driving circuit and a connection between the driving unit and a motor driven by the driving. The second bonding wire is coupled between a fault out pin of the first driving IC, the second driving IC and the third driving IC.