Invention Grant
- Patent Title: Amplification device and matching circuit board
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Application No.: US17614952Application Date: 2021-03-30
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Publication No.: US12328101B2Publication Date: 2025-06-10
- Inventor: Tadashi Minami
- Applicant: Sumitomo Electric Device Innovations, Inc.
- Applicant Address: JP Yokohama
- Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee: Sumitomo Electric Device Innovations, Inc.
- Current Assignee Address: JP Yokohama
- Agency: Volpe Koenig
- Priority: JP2020-060465 20200330
- International Application: PCT/JP2021/013568 WO 20210330
- International Announcement: WO2021/200963 WO 20211007
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H03F1/08 ; H03F3/193 ; H03F3/21

Abstract:
An amplification device includes a base substrate, an amplification element, and a matching circuit board. The amplification element is mounted on the base substrate. The matching circuit board is mounted on the base substrate and includes a circuit pattern which is electrically connected to the amplification element. The matching circuit board includes a first side surface and a second side surface each extending in the longitudinal direction of the matching circuit board. A first recess is provided in the first side surface. A second recess facing the first recess is provided in the second side surface.
Public/Granted literature
- US20220239260A1 AMPLIFICATION DEVICE AND MATCHING CIRCUIT BOARD Public/Granted day:2022-07-28
Information query
IPC分类: