A system for controlling heat transfer between components. The system includes a first component and a second component spaced apart from the first component. The system also includes a thermal diode positioned between the first and second components. The thermal diode includes a negative coefficient of thermal expansion layer and a positive coefficient of thermal expansion layer. The thermal diode is configured to transition between a connected state and a disconnected state. The thermal diode is configured to transition back-and-forth between the connected and disconnected states with variations in at least one of a first temperature of the first component or a second temperature of the second component.