Invention Grant
- Patent Title: Multi-layer coil component
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Application No.: US17701448Application Date: 2022-03-22
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Publication No.: US12334247B2Publication Date: 2025-06-17
- Inventor: Akihiko Oide , Makoto Yoshino , Tomoki Okada , Hideki Saitou , Seiji Osada , Kazuhiro Ebina , Kunio Oda , Takashi Abe , Akio Shibata , Kazuo Iwai
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2021-057711 20210330
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F17/00

Abstract:
In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when viewed from the stacking direction of the element body. Therefore, the coil has a concave-convex portion. When a force is applied to the multi-layer coil component from the outside, the force is dispersed in the concave-convex portion of the coil, and thus defects are less likely to occur in the coil than in a coil in which the side of the side surfaces is flat.
Public/Granted literature
- US12300423B2 Multi-layer coil component Public/Granted day:2025-05-13
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