An apparatus for treating a substrate includes a transfer part, a first transfer robot and a second transfer robot disposed in a longitudinal direction of the transfer part, a liquid treating part disposed at one side of the transfer part to apply a liquid onto the substrate by supplying the liquid to the substrate, and a heat treating part disposed at an opposite side of the transfer part to face a first process treating part, to perform heat-treatment with respect to the substrate. The heat treating part includes a cooling transfer module to transfer the substrate between the first transfer robot and the second transfer robot and to cool the substrate.