Invention Grant
- Patent Title: Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
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Application No.: US17478321Application Date: 2021-09-17
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Publication No.: US12334401B2Publication Date: 2025-06-17
- Inventor: Hideto Tateno , Satoshi Takano
- Applicant: Kokusai Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Kokusai Electric Corporation
- Current Assignee: Kokusai Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edell, Shapiro & Finnan, LLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; C23C16/34 ; C23C16/455 ; C23C16/46 ; C23C16/52 ; H01L21/02 ; H01L21/285 ; H01L21/67 ; H01L21/677

Abstract:
According to one aspect of the present disclosure, there is provided a technique that includes: a substrate retainer; a reaction tube; a heater configured to heat an inside of the reaction tube; a gas supplier configured to supply a process gas to substrates accommodated in the reaction tube; an exhauster configured to exhaust the process gas from the inside of the reaction tube; a temperature detector configured to measure an inner temperature of the reaction tube; a reflectance detector configured to measure a reflectance of a film formed by supplying the process gas through the gas supplier; and a controller configured to be capable of performing a feedback control of film-forming conditions on the substrates accommodated in the reaction tube by using temperature information measured by the temperature detector and reflectance information measured by the reflectance detector.
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Information query
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