Invention Grant
- Patent Title: Semiconductor package structure and method for forming the same
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Application No.: US17718454Application Date: 2022-04-12
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Publication No.: US12334444B2Publication Date: 2025-06-17
- Inventor: Po-Hao Chang , Yi-Jou Lin , Hung-Chuan Chen
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/498 ; H01L25/00 ; H01L25/065

Abstract:
A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
Public/Granted literature
- US20220238446A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2022-07-28
Information query
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