Invention Grant
- Patent Title: Optical semiconductor integrated element and method of manufacturing optical semiconductor integrated element
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Application No.: US17600811Application Date: 2019-06-11
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Publication No.: US12334712B2Publication Date: 2025-06-17
- Inventor: Tsutomu Yamaguchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker Brackett PLLC
- International Application: PCT/JP2019/023014 WO 20190611
- International Announcement: WO2020/250291 WO 20201217
- Main IPC: H01S5/22
- IPC: H01S5/22 ; H01S5/026 ; H01S5/343

Abstract:
An optical semiconductor integrated element comprises a laser section and a photodetector section which are arranged on the same semiconductor substrate, the laser section and the photodetector section each have a light confining layer which confines light, a cladding layer, and a contact layer formed of an InGaAs layer or an InGaAsP layer, the light confining layer of the laser section is an active layer, the contact layer of the photodetector section is a light absorption layer, each cladding layer is a ridge structure having a shape in which a width at a side of the light confining layer is narrower than a width at a side of the contact layer in a cross-section which is perpendicular to the optical axis, and on a side surface of the light confining layer, the cladding layer and the contact layer, a semiconductor embedded layer is not provided.
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