Invention Grant
- Patent Title: Multi-layer resonator assembly and method for fabricating same
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Application No.: US17566144Application Date: 2021-12-30
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Publication No.: US12334906B2Publication Date: 2025-06-17
- Inventor: Lovelace Soirez , Jeffrey R. LaRoche
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Getz Balich LLC
- Main IPC: H03H9/17
- IPC: H03H9/17 ; H03H3/02 ; H10D30/47 ; H10N39/00

Abstract:
A method for fabricating a multi-layer resonator assembly includes sequentially fabricating a plurality of vertically-stacked resonator layers including, for each resonator layer of the plurality of resonator layers, depositing a dielectric layer, forming at least one film bulk acoustic resonator (FBAR) cavity in the deposited dielectric layer, filling each FBAR cavity of the at least one FBAR cavity with a sacrificial material block, and depositing a FBAR material stack over the at least one FBAR cavity. The deposited FBAR material stack is in contact with the sacrificial material block and the dielectric layer. The method further includes removing the sacrificial material block from the at least one FBAR cavity for each resonator layer of the plurality of resonator layers subsequent to sequentially fabricating the plurality of resonator layers.
Public/Granted literature
- US20230216480A1 MULTI-LAYER RESONATOR ASSEMBLY AND METHOD FOR FABRICATING SAME Public/Granted day:2023-07-06
Information query
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