A radio-frequency module includes power amplifiers on a major surface of a module substrate, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band A, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band C, a transmit filter coupled to an output terminal of the power amplifier to pass a transmit signal in a communication band E, a resin member covering the major surface, a metal shield layer covering a surface of the resin member, and a metal shield plate on the major surface between the power amplifier and the power amplifier and also between the power amplifier and the power amplifier. The metal shield plate is in contact with a first ground electrode at the major surface and also with the metal shield layer.