Invention Grant
- Patent Title: Method for manufacturing flexible printed circuit board
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Application No.: US17923424Application Date: 2021-06-11
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Publication No.: US12336091B2Publication Date: 2025-06-17
- Inventor: Ga Young Woo , Seog Jin Yoon
- Applicant: LG ENERGY SOLUTION, LTD.
- Applicant Address: KR Seoul
- Assignee: LG ENERGY SOLUTION, LTD.
- Current Assignee: LG ENERGY SOLUTION, LTD.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2020-0073635 20200617
- International Application: PCT/KR2021/007363 WO 20210611
- International Announcement: WO2021/256790 WO 20211223
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/00 ; H05K3/38 ; H05K13/04

Abstract:
The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.
Public/Granted literature
- US20230199945A1 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD Public/Granted day:2023-06-22
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