A system for dismantling defective BGA chips from double-sided PCBA having a fix stage and a cooling stage. The fix stage includes at least one shield that prevents hot air from a hot air gun to heat BGA chips that are adjacent to the defective BGA chips. The cooling stage prevents overheating of the BGA chips that are on the opposite side of the double-sided PCBA by conducting heat away from the BGA chips during the process.