Invention Grant
- Patent Title: Ferroelectric semiconductor device and method
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Application No.: US18447453Application Date: 2023-08-10
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Publication No.: US12336216B2Publication Date: 2025-06-17
- Inventor: Chia-Cheng Ho , Ming-Shiang Lin , Jin Cai
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H10D30/62
- IPC: H10D30/62 ; H01L21/02 ; H10D30/01 ; H10D64/68

Abstract:
A ferroelectric semiconductor device and method are described herein. The method includes performing a diffusion anneal process to drive elements of a dopant film through an amorphous silicon layer and into a gate dielectric layer over a fin to form a doped gate dielectric layer with a gradient depth profile of dopant concentrations. The doped gate dielectric layer is crystallized during a post-cap anneal process to form a gradient depth profile of ferroelectric properties within the crystallized gate dielectric layer. A metal gate electrode is formed over the crystallized gate dielectric layer to obtain a ferroelectric transistor with multi-ferroelectric properties between the gate electrode and the channel. The ferroelectric transistor may be used in deep neural network (DNN) applications.
Public/Granted literature
- US20230387310A1 Ferroelectric Semiconductor Device and Method Public/Granted day:2023-11-30
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